Kingston SODIMM DDR3 4Gb PC1600 HyperX Impact
(2)| FACTOR DE FORMA | SODIMM 204 espigas | |
| CAPACIDAD | 4Gb | |
| TIPO DE RAM | DDR3 | |
| VELOCIDAD | 1600 Mhz | |
| Nº MODULOS | 1 | |
| LATENCIA RAM | CL9 | |
| TENSION | 1.35 v | |
| COMPATIBLE MAC |
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| ECC |
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Descripcion
HyperX HX316LS9IB/4 is a 512M x 64-bit (4GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory module, based on eight 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3L-1600 at a low latency timing of 9-9-9 at 1.35V or 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
Nota:
The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS.
PnP JEDEC TIMING PARAMETERS:
• DDR3-1600 CL9-9-9 @1.35V or 1.5V
• DDR3-1333 CL8-8-8 @1.35V or 1.5V
• DDR3-1066 CL6-6-6 @1.35V or 1.5V
Especificaciones:
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 33.75ns (min.)
Maximum Operating Power TBD W* @1.35V
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
Caracteristicas
• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component
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